SEMI G77 - Specification for Frame Cassette for 300 mm Wafers -

Member Price: $130.00
Non-Member Price: $170.00

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G77-0699 (Reapproved 1020) - Current



The purpose of this Standard is to specify the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die-bonding process.

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces.


Only the physical interfaces for the frame cassette are specified; no materials requirements or micro-contamination limits are given. However, this Specification was written to allow for both metal and plastic frame cassette designs.

Referenced SEMI Standards (purchase separately) 

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for 300 mm Tool Load Port

SEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers

SEMI E57 ¾ Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers

SEMI G74 ¾ Specification for Tape Frame for 300 mm Wafers

SEMI S8 ¾ Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment

Revision History

SEMI G77-0699 (Reapproved 1020)

SEMI G77-0699 (Reapproved 0215) 

SEMI G77-0699 (Reapproved 0706) 

SEMI G77-0699 (first published) 


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