SEMI G77 - Specification for Frame Cassette for 300 mm Wafers -

Abstract

1  Purpose
1.1  This Standard specifies the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die-bonding process.
2  Scope
2.1  This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces.
2.2  Only the physical interfaces for the frame cassette are specified; no materials requirements or micro-contamination limits are given. However, this Specification was written to allow for both metal and plastic frame cassette designs.
2.3  This Specification defines a 300 mm wafer frame cassette that is intended for both manual and automated transport.
NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.

Referenced SEMI Standards (purchase separately)
SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for 300 mm Tool Load Port
SEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers
SEMI E57 — Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers
SEMI S8 — Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

Revision History
SEMI G77-0699 (Reapproved 0426)
SEMI G77-0699 (Reapproved 1020)
SEMI G77-0699 (Reapproved 0215) 
SEMI G77-0699 (Reapproved 0706) 
SEMI G77-0699 (first published) 

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