SEMI G81 - Specification for Map Data Items
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 11, 2014. Available at www.semiviews.org and www.semi.org in March 2015; originally published October 2000; previously published March 2007.
This Document describes the data items that relate to electronic substrate mapping.
This Document applies only to substrate map data items.
This Document does not address the transmission, file naming conventions, storage or archiving of substrate maps.
The Specification of which data items are optional and which are required is not specified in this Document.
The size of each data item described in this Document is maximum size. The actual size may be further restricted by an application document.
The order of the data items is not restricted in this Document. The order of the data items may be restricted by an application document.
SEMI G81.1-0307 (Reapproved 0315) - Specification of Grand Concept of Map Data for Characteristics of Dice on Substrate
Referenced SEMI Standards
SEMI E5 — SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI T9 — Specification for Marking of Metal Lead-Frame Strips with a Two-Dimensional Data Matrix Code Symbol
|Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.|