G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 6, 2016. Available at www.semiviews.org and www.semi.org in February 2017; originally published March 2003; previously published August 2011.
This Test Method defines a procedure for the evaluation of die strength by the mean of 3-point bending method.
This Test Method applies only for 3-point bending method, and other methods will be defined by the separate documents.
This Test Method is used to measure die strength for dies from processed wafers.
Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and certification. This Standard is one of the documents, which describe the Die Strength Evaluation Method, Measurement Data Summary Technique and Data Usage for Test Report.
Referenced SEMI Standards
SEMI G96 — Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending
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