![G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer](http://store-us.semi.org/cdn/shop/files/GVolume_9e7216d1-d362-4518-b685-1977de00296b.png?v=1692965435&width=2049)
SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer -
Abstract
The purpose of
this Document is to standardize the specification of a plastic tape frame, for
a 300 mm wafer, which is used between the dicing process and the die bonding
process, and for the handling and shipping of wafers.
This
Specification is applicable to plastic tape frames for 300 mm wafers.
This Standard
puts in writing the dimensions, mechanical characteristics and measurement
method for the 300 mm wafer tape frame.
This Standard
can be used as a specification when purchasing tape frames.
None.
Revision History
SEMI G87-1108
(Reapproved 1020)
SEMI G87-1108 (Reapproved 0215)
SEMI G87-1108 (first published)
![]() |
Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards. |
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.
![G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer](http://store-us.semi.org/cdn/shop/files/GVolume_9e7216d1-d362-4518-b685-1977de00296b.png?v=1692965435&width=2049)
This product has no reviews yet.