G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer

SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer -

Member Price: $138.00
Non-Member Price: $180.00

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G87-1108 (Reapproved 1020) - Current

Revision

Abstract

The purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers.


This Specification is applicable to plastic tape frames for 300 mm wafers.

 

This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame.

 

This Standard can be used as a specification when purchasing tape frames.


Referenced SEMI Standards (purchase separately) 

None.


Revision History

SEMI G87-1108 (Reapproved 1020)

SEMI G87-1108 (Reapproved 0215)

SEMI G87-1108 (first published)




 


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