SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 11, 2014. Available at and in February 2015; originally published November 2008.


The purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers.


This Specification is applicable to plastic tape frames for 300 mm wafers.


This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame.


This Standard can be used as a specification when purchasing tape frames.


Referenced SEMI Standards


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