SEMI G88 - Specification for Tape Frame for 450 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 8, 2016. Available at and in February 2017; originally published February 2011.


The purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die-bonding process, and also used for shipping and handling.


This Standard is applicable to 450 mm wafer tape frames.


This Standard documents the dimensions, characteristics, and measurement methods for 450 mm wafer tape frames.


This Standard can be used as the specification sheet for tape frame upon purchasing.


Referenced SEMI Standards


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