G08900 - SEMI G89 - Specification for Leadframe Strip Size

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018; originally published February 2011.

 

The purpose of this Document is to standardize the strip size specification of leadframe. This defines the width and length of a leadframe strip.

 

This Specification is applicable to various types of quad flat package (QFP) leadframe strips, and small outline package (SOP) leadframe strips.

 

This Standard can be used as a specification when purchasing these leadframe.

 

The configuration of unit designs should be made per the IC chip information, so this Document does not cover the unit size design or configuration.

 

Referenced SEMI Standards

None.

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