SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process.

 

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces.

 

Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds or cleanliness are not defined.

 

This Standard specifies both semi-automated (PGV) and automated (AGV or OHT) handling of the tape frame cassette for 450 mm wafer. It does not intend to address manual handling.

 

A 450 mm wafer frame cassette has the following components and optional components. Optional components are not required features for the 450 tape frame cassette (TFC). They can be added according to customers’ demands or manufacturing problems.

 

Referenced SEMI Standards (purchase separately)

SEMI G88 — Specification for Tape Frame for 450 mm Wafer
SEMI G95 — Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in Backend Process

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