SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer -
Abstract
The purpose of this Standard is to specify mechanical
features for the 450 mm wafer tape frame cassette used between the wafer
mounting process and the die-bonding process.
This Standard is intended to set an appropriate level of
specification that places minimal limits on innovation while ensuring
modularity and interchangeability at all mechanical interfaces.
Only the mechanical interfaces for the tape frame cassette
are specified. Materials kinds or cleanliness are not defined.
This Standard specifies both semi-automated (PGV) and
automated (AGV or OHT) handling of the tape frame cassette for 450 mm wafer. It
does not intend to address manual handling.
A 450 mm wafer frame cassette has the following components
and optional components. Optional components are not required features for the
450 tape frame cassette (TFC). They can be added according to customers’
demands or manufacturing problems.
Referenced SEMI Standards
SEMI G88 — Specification for Tape Frame for 450 mm Wafer
SEMI G95 — Specification for Mechanical Features of 450 mm
Load Port for Tape Frame Cassettes in Backend Process
Revision History
SEMI G92-0315 (Reapproved 1220)
SEMI G92-0315 (technical revision)
SEMI G92-0814 (technical revision)
SEMI G92-1113 (technical revision)
SEMI G92-0412 (first published)
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