SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 21, 2012. Available at and in April 2012.


The purpose of this Document is to define a procedure for the size measurement method of solder spheres used for ball grid array (BGA) packages.


Referenced SEMI Standards


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