G09300 - SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package

SEMI G93 - Measurement Method for Solder Sphere Size for Ball Grid Array Package -

Member Price: $138.00
Non-Member Price: $180.00

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G93-0412 - Inactive

Revision

Abstract


NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

 

The purpose of this Document is to define a procedure for the size measurement method of solder spheres used for ball grid array (BGA) packages.

 

This measurement method is applicable for solder spheres which are used for electrical interconnect between the package and printed circuit boards (PCBs).

 

This measurement method is used to measure the size of solder spheres, and these measurement data are used in the test report as a Certificate of Analysis.

 

This Standard can be used as a specification when purchasing these solder spheres.

 

Referenced SEMI Standards (purchase separately)

None.

 

Revision History

SEMI G93-0412 (first published)

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