SEMI G94 - Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
This Standard was technically approved by the 3D Packaging and Integration Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 6, 2018. Available at www.semiviews.org and www.semi.org in November 2018; originally published January 2013.
The purpose of this Document is to standardize the specifications for coin-stack type tape frame shipping container for 300 mm wafer used for test and packaging processes for wafers.
defines the dimensions of container and requirements for securing the interface between container and processing equipment or wafer transportation equipment.
This Document specifies the requirements for wafer spacers used for separation of wafers and for a cushion material used for wafer protection.<br><br>This Document specifies the electrical characteristics and requirements for hazardous substance for the material of container.
The maximum number of tape frame wafers of both metal (SEMI G74) and plastic (SEMI G87) stored in the container shall be 13.
Referenced SEMI Standards
SEMI G59 — Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SEMI G74 — Specification for Tape Frame for 300 mm Wafers
SEMI G87 — Specification for Plastic Tape Frame for 300 mm Wafer