SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on June 17, 2014. Available at www.semiviews.org and www.semi.org in October 2014.
This Test Method defines a procedure for evaluation of die strength by mean of cantilever bending where 3 point bending is not easy to measure strength in case of wafer thickness less than 50 μm.
This Test Method applies only for cantilever bending method, and other methods will be defined by separate documents.
This Test Method is used to measure die strength for dies from processed wafers.
Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and certification. This Standard extends to the region of ultra-thin thickness from 3 point bending measurement method SEMI G86-0303 which describes the Die Strength Evaluation Method, Measurement Data Summary Technique and Data Usage for Test Report.
Referenced SEMI Standards
SEMI G86 — Test Method for Measurement of Chip (Die) Strength by Mean of 3 Point Bending