SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 8, 2016. Available at and in June 2017; originally published January 2016.


The purpose of this Document is to establish a standard for the specification of adhesive trays for thin chip handling.


This Document covers thin chip handling adhesive trays.


This Document specifies the size and various properties of the adhesive trays.


This Standard may be used as a specification for procurement of adhesive trays.


Referenced SEMI Standards


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