G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
Type: Single Standards Download (.pdf)
Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these materials require the different characteristics and performances.
The characteristics of encapsulation materials such as wettability needs to be recognized and defined to enable the qualified encapsulation processes for large panel size.
This Specification focuses on the wettability of encapsulation material used in the manufacturing of WLP and PLP processes.
This methodology is defined to measure the wettability by half-angle method.
Referenced SEMI Standards (purchase separately)
SEMI G83 — Specification for Bar Code Marking of Product Packages
SEMI G104-1122 (first published)
|Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.|
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.
Member Price: $113.00
Regular price Non-Member Price: $150.00