HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
This Standard was technically approved by the HB-LED Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 17, 2018. Available at www.semiviews.org and www.semi.org in December 2018; originally published June 2013.
This Specification provides the dimensional requirements for plastic and metal wafer cassettes used for the processing and handling of 150 mm diameter HB-LED sapphire wafers conforming to the SEMI Standard.
This Specification is for general usage and outlines the basic requirements for open cassettes for 150 mm sapphire wafer sizes.
This Document provides basic interface requirements for automated substrate handling.
To meet these specifications, cassettes must be manufactured within the dimensional limits and be dimensionally stable within the specification when used in accordance with manufacturers’ recommendations.
Referenced SEMI Standards
SEMI HB1 — Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
|Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.|
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.