SEMI HB4 - Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI) -

Abstract

The purpose of this Standard is to define the equipment automation interface for communication and control of process, automation and metrology equipment used in high brightness light emitting diode (HB-LED) manufacturing. It intends to produce economic benefits for both manufacturers and equipment suppliers by identifying a subset of relevant functionalities out of the existing SEMI Communications Standards for the application in HB-LED manufacturing facilities. On one hand this Standard should reduce the effort of manufacturers to integrate equipment in their IT factory automation system. On the other hand equipment suppliers could reduce their effort for developing and maintaining a variety of equipment communication interfaces. It is expected to provide a proven set of communication functionality to reduce both costs and time for ramp-up of new equipment in the manufacturing production environment.

This Specification references a collection of SEMI and other standards and should give guidance on how to apply them in the HB-LED manufacturing environment in order to establish a reliable and extensible communication framework for the IT integration of equipment.

This Specification for HB-LED equipment communication interface applies to all HB-LED manufacturing equipment including process, automation and metrology systems used in the Front-End and Back-End production area. However, it is not limited to these areas of application.

The scope of this Standard is limited to the communication interface used to integrate equipment within factory automation systems.

This Standard can be applied to single wafer equipment as well as batch equipment.

This Standard intends to lay the foundation for a reliable and extensible IT integration framework for HB-LED manufacturing based on proven standards using a multilayered approach. The Standard references existing SEMI Communication Standards to realize these layers as much as possible. The resulting framework is referred to as HB-LED equipment communication interface (HB-LED ECI).

• This Standard defines a physical/data link layer based on Ethernet.
• This Standard utilizes SEMI E37/SEMI E37.1 for message transfer.
• This Standard defines a message and data item set based on SEMI E5.
• This Standard defines the behavior of HB-LED equipment communication interface based on SEMI E30.

The SEMI Standards named in this Scope are used essentially in the same manner as in the semiconductor industry. However, a small set of restrictions and new features have been defined to simplify their application in the HB-LED industry and thereby to improve the level of acceptance and consistency. This Standard contains one subsection for each layer that describes the restrictions that apply for HB-LED manufacturing. Nevertheless, it should be easy to adjust interface implementation developed for semiconductor industry to fulfill these restrictions.

Referenced SEMI Standards (purchase separately)

SEMI E5 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)

SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)

SEMI E37 — Specification for High-Speed SECS Message Services (HSMS) Generic Services

SEMI E37.1 — Specification for High-Speed SECS Message Services Single Selected-Session Mode (HSMS-SS)

SEMI E40 — Specification for Processing Management

SEMI E87 — Specification for Carrier Management (CMS)

SEMI E94 — Specification for Control Job Management

SEMI E148 — Specification for Time Synchronization and Definition of the TS-Clock Object

Revision History

SEMI HB4-0122 (technical revision)

SEMI HB4-0913 (Reapproved 0419)

SEMI HB4-0913 (first published)

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