IC Packaging Intermediate Certification

It's highly recommended that you complete the Beginner Level of IC Packaging Bundle and Certification Exam before registering for this course content.

 

Curriculum Description 

This intermediate-level curriculum is designed for engineers and professionals seeking a deeper understanding of integrated circuit (IC) packaging technologies. As the semiconductor industry continues to evolve and expand across sectors usch as consumer electronics, communications, automotive, and medical devices, mastering the intricacies of IC packaging becomes essential. This bundle includes four comprehensive courses that explore critical components and processes involved in IC packaging: Interposers and Its Processes, Interconnects and Its Processes, Front-End Assembly Line Processes, and Back-End of Line Assembly Processes.

 

By completing this curriculum, learners will gain interdisciplinary knowledge spanning mechanical, materials, chemical, and electronics engineering, empowering them to address complex challenges in design and manufacturing operations.

At the end of the training, learners must complete the final exam to receive certification. This exam will consist of 100 questions. Learners have up to three attempts to pass the exam. A passing score of 75% is required. If you do not pass the test after three attempts, you must re-enroll in the curriculum. This certification is valid for three years and is issued by SEMI.

 

Courses Included

 

Interposers and Its Processes 

Explore the foundational role of Interposers in IC Packaging. This course covers various interposer types- leadframe, ceramic, silicon glass, rigid substrate, and flex-and their respective fabrication flows. Learners will understand the functions and development of interposers and how they influence packaging performance and reliability. 

Key Topics:

Functions of interposers

Leadframe and ceramic fabrication flows

Silicon and glass interposers

Rigid and flex substrates

Interposer development processes

 

Interconnects and Its Processes

Dive into the technologies that enable electrical connections within microelectronic packages. This course provides a comparative analysis of wirebonding, tape automated bonding (TAB), and flip chip technologies, highlighting their applications, advantages, and process flows. 

Key Topics:

Wirebonding technologies

Tape automated bonding (TAB)

Flip chip technologies

Comparative analysis of interconnect methods

 

Front of Line Assembly Processes

Learn about the front-of-line packaging assembly concepts such as key package assembly technologies of backgrinding, dicing, and die attach device. Their various processes, materials, and future direction to meet the semiconductor application needs. 

Key Topics:

Backgrinding technologies

Dicing technologies

Die attach technologies

Comparative analysis of interconnect methods

 

Back-End of Line Assembly Processes

Gain insights into the final stages of IC packaging assembly. This course focuses on the assembly processes for wirebond leadframe and flip chip on substrate packages, including molding, underfilling, pating, ball attach, and PCB assembly. Learners will explore the materials, process parameters, and reliability considerations essential for high-performance packaging.

Key Topics:

Molding technologies

Underfilling and encapsulants for flip chips

Plating for leadframe

Ball attach and intermetallic

PCB Assembly  

 

Curriculum Duration 

4.5 hours, Certification exam 1.5 hours

 

 

Target Audience 

This curriculum is ideal for intermediate-level engineers, technicians, and professionals in the semiconductor packaging, manufacturing, and design roles who are looking to expand their technical expertise and stay ahead in a rapidly evolving industry. 

 

 

Requisite Knowledge 

The passing of the IC Packaging Beginner Level certification exam, OR a sufficient understanding of introductory concepts of IC Packaging, PCB board assembly, and soldering, and general assembly processes.