Inside the Fab:An Introduction to Semiconductor Mfg. 8/10

Inside the Fab – An Introduction to Semiconductor Manufacturing

Dates & Times

August 10^th – 13^th, 2026 (4 days)

10:00am– 2:00pm GMT +8  

Location

Virtual

Pricing

Early Bird Special $100 off

Members: $399

Non-Members: $449

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.  

Learning Objectives

Upon completion of the course, participants should be able to:

• Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
• Identify and correctly use common semiconductor manufacturing terminology.
• Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
• Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

• Basic Electronics and Microelectronics
• Process Nodes
• Device Physics and Transistor Operation
• Crystal Growth and Wafer Preparation
• Advanced Transistor Technologies
• Circuit Design and Layout
• Wafer Processing

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to assess the course knowledge.