Interconnects and Its Processes

Course Description

The semiconductor industry provides critical enabling technology for many products and fields and has seen periods of rapid growth.  While electronic goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential.

This course provides an an in-depth understanding of interconnects such as wire-bonding, tape automated bonding, and different flip chip technologies for microelectronics packaging.  This is the 5th course of the IC Packaging curriculum and is for the intermediate learner. By learning about the concepts taught in this course, engineers can take more issues they encounter in their design and manufacturing operations. After all, IC Packaging requires interdisciplinary knowledge such as mechanical, materials, chemical, and electronics engineering. 

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