Interposers and Its Processes

Course Description 

The semiconductor industry provides critical enabling technology for many products and fields and has seen periods of rapid growth. While electronic goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential.

This course provides an overview of devices of interposers such as leadframe, ceramic, silicon, glass, rigid substrate, and flex for packaging. This is the first course of the IC packaging for the intermediate packaging curriculum. By learning about the concepts taught in this course, engineers can take more issues they encounter in their design and manufacturing operations. After all, IC packaging requires interdisciplinary knowledge such as mechanical, materials, chemical, and electronics engineering. 

Course Topics:

• Function of interposer
• Leadframe and its fabrication flow
• Ceramics and its fabrication flow
• Silicon glass interposers
• Rigid substrates and their key processes
• Flex interposers
• Interposer development

Course Duration 

50 minutes  

Target Audience

Sales engineers/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready. 

Requisite Audience

At least some college-level scientific knowledge