Introduction to IC Packaging

Course Description 

The semiconductor industry provides critical enabling technology for many products and fields and has been in periods of rapid growth.  While electronics goods dominate the market, communications, medical devices and the automotive industry show signs of increased potential. The course provides an overview of semiconductor devices that are packaged to meet the size, cost and package performance to meet the various applications.  The package performance includes electrical, thermal and reliability to meet the growth of the semiconductor demands in this application.  Those interested in IC packaging will learn about the functions of IC packaging and existing BGA, CSP 3D packaging, WLP packaging etc. to meet the semiconductor application needs. This course is the first course of the IC Packaging curriculum for beginners. By learning about the concepts taught in this course, engineers can take more issues they encounter in their design and manufacturing operation.  Afterall, IC packaging required interdisciplinary knowledge, such as mechanical, materials, chemical and electronics engineering.  

Course Objectives 

• Explain the functionality of microelectronics packaging.
• Review the various packaging trends over time.
• Describe system packaging and heterogeneous integration.
• Identify the main challenges in packaging.  

Course Duration

90 minutes

Target Audience 

Sales engineers/business development executives, college students who are interested in joining the semiconductor industry especially OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can take advantage of this course to ensure their workforce is ready. 

Requisite Knowledge 

None

Biography

Dr. Lee Teck Kheng received the B.S. degree in Mechanical Engineering and a M.S. Degree in Materials Science and Engineering from the National Univ. of Singapore in 1995 and 1999 respectively and a Ph.D. degree in Mechanical and Aerospace Engineering from Nanyang Technology Univ., Singapore in 2006. He founded Technology Development Centre at ITE College Central. He drives ITE innovations with the development of strategic plans and organization re-structure for innovation. This setup ITE Technology Transfer office in 2018 and collaborate with various Institute of higher IEOs to catalyst Singapore Research Innovation Enterprise Initiative. He has led a team of 20 engineers and research to support the nations initiative of Research Innovation Enterprise for ITE. The centre awarded $3M competitive grants and more than 500 industry projects at $4M. In 1999, he joined Micron Semiconductor Asia Pte. Ltd. and was promoted to Senior Technical Member. He was responsible for substrate supplier management and leading research programs in the field of advanced packaging and material characterization. His past experience included pioneering MEMS packaging and initiating Chip scale packaging and flip chip packaging with his stay in A-star Institue of Microelectronics from 1997-1999.  

He has authored and co-authored more than 60 papers in journal and international conference. Currently, he holds 74 U.S. patents, pending another 20 patents from issuing. He serves as a current/past committee member for Singapore Chinese Chamber of Commerce, SEMI and SSIA, IEEE semiconductor group, EPTC. Currently he leads the aligning of international standard committee member for semiconductor under IEC TC47. He taught as a part-time lecturer in NTU for Microelectronics packaging since 2009-2014. He is also a member of IEEE, CPMT, IES, Material Research Society and IMPAS societies. He also performed several overseas workshops as well as honor in Marquis Who's Who (2008-2020) and International Biographical Centre.