Leadframe and Substrate Package Assembly Process

Course Description 

This course provides an overview of the leadframe and substrate package assembly processes. It provides an overview of the leadframe and substrate material before diving into the package assembly processes. The assembly processes of QFP leadframe and flip chip BGA package from wire bond, die-attach, and flip chip to package singulation will be shared in this course. 

Course Objectives 

• Identify the materials in the leadframe and rigid substrate structure 
• Describe the front-of-line assembly processes and defects 
• Explain the end-of-line assembly processes and defects 
• Describe the typical leadframe and substrate assembly processes 
• Explain how the materials affect the assembly processes  

Course Duration 

70 minutes  

Target Audience

Sales engineers/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready. 

Requisite Audience

At least some college-level scientific knowledge