SEMI M8 - Specification for Polished Monocrystalline Silicon Test Wafers
This Standard was technically approved by the Silicon Wafer Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 1, 2018. Available at www.semiviews.org and www.semi.org in July 2018; originally published in 1982; previously published July 2018.
This Specification covers requirements for virgin silicon test wafers to be used for mechanical testing, and routine process monitoring in semiconductor manufacturing.
This Specification covers dimensional and crystallographic properties of monocrystalline virgin silicon test wafers together with selected electrical and surface defect characteristic.
This Specification covers virgin test wafers in all standard wafer diameters from 2 inch to 300 mm. It classifies test wafers according to the items specified. It provides three classes of smaller diameter test wafers (through 125 mm), and two classes of larger diameter test wafers (from 150 mm).
This Specification does not cover test wafers intended for applications placing higher demands on silicon wafers, such as particle counting, measuring resolution in a photolithography process, or monitoring metallic contamination; for wafers to be used in these applications, the user should reference SEMI M24.
For reference purposes, U.S. customary units shall be used for wafers of 2- and 3-inch nominal diameter and System International (SI), commonly called metric units, for 100 mm and larger diameter wafers.
Referenced SEMI Standards
SEMI M1 — Specification for Polished Single Crystal Silicon Wafers
SEMI M24 — Specification for Polished Monocrystalline Silicon Premium Wafers
SEMI M45 —Specification for 300 mm Wafer Shipping System
SEMI M59 — Terminology for Silicon Technology
SEMI T3 — Specification for Wafer Box Labels
SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
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