SEMI M9 - 鏡面単結晶ガリウムヒ素スライスの仕様 -

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Non-Member Price: $215.00

Volume(s): Materials
Language: Japanese
Type: Single Standards Download (.pdf)
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Revision: SEMI M9-0211 - Superseded

Revision

Abstract

本スタンダードは,global Compound Semiconductor Materials Committeeで技術的に承認されている。現版は20101221日,global Audits and Reviews Subcommitteeにて発行が承認された。20112月にwww.semiviews.orgおよび www.semi.orgで入手可能となる。初版は1986年発行,前版は20083月に発行された。

 

本仕様は,半導体および電子デバイス製造に使用される単結晶高純度ガリウムヒ素ウェーハの2つのグループの基板に対する要求条件について述べている。寸法と結晶方位の特性および表面欠陥の限度のみが下記に標準化された性能として述べられている。

 

Subordinate Documents:

SEMI M9.1-96E (Reapproved 0308) — Standard for Round 50.8 mm Polished Monocrystalline Gallium Arsenide Wafers for Electronic Device Applications

SEMI M9.2-96E (Reapproved 0308) — Standard for Round 76.2 mm Polished Monocrystalline Gallium Arsenide Wafers for Electronic Device Applications

SEMI M9.3-89 — Standard for Round 2 inch Diameter Polished Monocrystalline Gallium Arsenide Slices for Optoelectric Applications

SEMI M9.4-89 — Standard for Round 3 inch Diameter Polished Monocrystalline Gallium Arsenide Slices for Optoelectric Applications

SEMI M9.5-96E (Reapproved 0308) — Standard for Round 100 mm Polished Monocrystalline Gallium Arsenide Wafers for Electronic Device Applications

SEMI M9.6-95E (Reapproved 0308) — Standard for Round 125 mm Diameter Polished Monocrystalline Gallium Arsenide Wafers

SEMI M9.7-0708 — Specification for Round 150 mm Diameter Polished Monocrystalline Gallium Arsenide Wafers (Notched)

SEMI M9.8-0306 — Specification for Round 200 mm Polished Monocrystalline Gallium Arsenide Wafers (Notched)

 

 

Referenced SEMI Standards

SEMI MF26 — Test Methods for Determining the Orientation of a Semiconductive SingleCrystal

SEMI MF154 — Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces

SEMI MF523 — Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces

SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers

SEMI MF534 — Test Method for Bow of Silicon Wafers

SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning

SEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials

SEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates

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