SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers

Volume(s): Equipment Automation Hardware / Materials
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Silicon Wafer Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 1, 2018. Available at www.semiviews.org and www.semi.org in July 2018; originally published June 1998; previously published July 2008.

 

This Standard specifies the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

 

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. However, this Standard has been written so that injection-molded plastic FOSBs can be manufactured in conformance with it, and those can be utilized for maintaining wafers quality during transportation, opening and closing the door.

 

This Standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and inspection, and in transferring the wafers from the FOSB to a front-opening unified pod (FOUP), front-opening box for interfactory transport (FOBIT) or open cassette inside an IC manufacturing facility. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the FOSB to a FOUP, FOBIT or open cassette using automated methods. As described in ¶ 5.4, the purchaser needs to specify which type of FOSB door is required:

  1. Manual door as described in ¶ 5.4.1; or
  2. Automated-shippable door as described in ¶ 5.4.2.

 

Referenced SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load Port
SEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers
SEMI E57 — Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers
SEMI E62 — Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)
SEMI M45 — Specification for 300 mm Wafer Shipping System
SEMI S8 — Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment

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