SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers -

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Non-Member Price: $180.00

Volume(s): Equipment Automation Hardware / Materials
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI M31-0718 - Inactive




NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.


This Standard specifies the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. However, this Standard has been written so that injection-molded plastic FOSBs can be manufactured in conformance with it, and those can be utilized for maintaining wafers quality during transportation, opening, and closing the door.


This Standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and inspection, and in transferring the wafers from the FOSB to a front-opening unified pod (FOUP), front-opening box for interfactory transport (FOBIT) or open cassette inside an IC manufacturing facility. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the FOSB to a FOUP, FOBIT or open cassette using automated methods. As described in ¶ 5.4, the purchaser needs to specify which type of FOSB door is required:

  • Manual door as described in ¶ 5.4.1; or
  • Automated-shippable door as described in ¶ 5.4.2.


Referenced SEMI Standards (purchase separately)

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for Tool Load Port

SEMI E15.1 — Specification for 300 mm Tool Load Port

SEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers

SEMI E57 — Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers

SEMI E62 — Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)

SEMI M45 — Specification for 300 mm Wafer Shipping System

SEMI S8 — Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment


Revision History

SEMI M31-0718 (technical revision)

SEMI M31-0708 (technical revision)

SEMI M31-0307 (technical revision)

SEMI M31-0706 (technical revision)

SEMI M31-0306 (technical revision)

SEMI M31-1105 (technical revision)

SEMI M31-0705 (technical revision)

SEMI M31-0305 (technical revision)

SEMI M31-1104 (technical revision)

SEMI M31-1103E (editorial revision)

SEMI M31-1103 (technical revision)

SEMI M31-0303 (technical revision)

SEMI M31-0999 (technical revision)

SEMI M31-0699 (technical revision)

SEMI M31-0299 (technical revision)

SEMI M31-0698 (first published)

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