SEMI M41 - Specification of Silicon-on-Insulator (SOI) for Power Device/ICs -
Abstract
NOTICE: This Document was completely rewritten in 2022.
This Specification covers requirements for silicon on insulator (SOI) for semiconductor power-device/IC manufacture. By defining inspection procedures and acceptance criteria, both users and suppliers may define product characteristics and quality requirements.
This Specification provides requirements of SOI wafers, which are used for power devices/ICs of specific voltage applications. The specification described here covers physical, electrical, and surface parameters of each layer along with each voltage range for wafers ≤200 mm and separately, the range for 300 mm wafers
Referenced SEMI Standards (purchase separately)
SEMI 3D17 — Specification for Reference Material for Bonded Wafer Stack Void Metrology
SEMI M1 — Specification for Polished Single Crystal Silicon Wafers
SEMI M12 — Specification for Serial Alphanumeric Marking of Silicon Wafers
SEMI M13 — Specification for Alphanumeric Marking of Silicon Wafers with Crystal Properties
SEMI M52 — Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations
SEMI M53 — Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Polystyrene Latex Spheres on Unpatterned Semiconductor Wafer Surfaces
SEMI M71 — Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI
SEMI MF26 — Test Methods for Determining the Orientation of a Semiconductive Single Crystal
SEMI MF42 — Test Methods for Conductivity Type of Extrinsic Semiconducting Materials
SEMI MF43 — Test Methods for Resistivity of Semiconductor Materials
SEMI MF84 — Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe
SEMI MF95 — Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer
SEMI MF110 — Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique
SEMI MF154 — Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces
SEMI MF523 — Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers
SEMI MF576 — Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry
SEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
SEMI MF847 — Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques
SEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
SEMI MF1152 —Test Method for Dimensions of Notches on Silicon Wafers
SEMI MF1153 — Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements
SEMI MF1188 — Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption with Short Baseline
SEMI MF1390 — Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning
SEMI MF1391 — Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption
SEMI MF1527 — Guide for Application of Silicon Standard Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
SEMI MF1535 — Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
SEMI MF1617 — Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectroscopy
SEMI MF1619 — Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with p-Polarized Radiation Incident at Brewster Angle
SEMI MF1630 — Test Method for Low Temperature FT-IR Analysis of Single Crystal Silicon for III-V Impurities
SEMI MF1726 — Practice for Analysis of Crystallographic Perfection of Silicon Wafers
SEMI MF1727 — Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers
SEMI MF1809 — Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers
Revision History
SEMI M41-0723 (complete rewrite)
SEMI M41-0615 (technical revision)
SEMI M41-1213 (technical revision)
SEMI M41-0707 (technical revision)
SEMI M41-1101 (technical revision)
SEMI M41-0701 (technical revision)
SEMI M41-0600 (first published)
Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards. |
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.
This product has no reviews yet.