SEMI M79 - 太陽電池用円盤状100 mm鏡面研磨単結晶ゲルマニウムウェーハの仕様 -

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Volume(s): Materials
Language: Japanese
Type: Single Standards Download (.pdf)
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Revision: SEMI M79-0211 - Superseded

Revision

Abstract

本スタンダードは,global Compound Semiconductor Materials Committeeで技術的に承認されている。現版は20101221日,global Audits and Reviews Subcommitteeにて発行が承認された。20112月にwww.semiviews.orgおよび www.semi.orgで入手可能となる。

 

本仕様では,半導体および電子デバイスの製造に使用される円盤状100 mm高純度単結晶ゲルマニウムウェーハの基板に関する要求事項をカバーする。

 

Referenced SEMI Standards

SEMI M1 — Specification for Polished Single Crystal Silicon Wafers
SEMI MF26 — Test Methods for Determining the Orientation of a Semiconductive Single Crystal
SEMI MF43 — Test Methods for Resistivity of Semiconductor Materials
SEMI MF154 — Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces
SEMI MF523 — Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers
SEMI MF534 — Test Method for Bow of Silicon Wafers
SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning
SEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
SEMI MF673 — Test Methods for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge
SEMI MF847 — Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon and Wafers by X-Ray Techniques
SEMI MF928 — Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
SEMI MF1390 — Test Method for Measuring Warp on Silicon Wafers by Automated Non-Contact Scanning
SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Non-Contact Scanning
SEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers
SEMI T5 — Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers

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