SEMI M79 - Specification for Round 100 mm Polished Monocrystalline Germanium Wafers for Solar Cell Applications -

Member Price: $144.00
Non-Member Price: $187.00

Volume(s): Materials
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI M79-0623 - Current

Revision

Abstract

 

This Specification covers substrate requirements for round 100 mm monocrystalline high-purity germanium wafers used in semiconductor and electronic device manufacturing.

 

A complete purchase specification may require that additional physical, electrical, and bulk properties be defined. These properties are listed, together with test methods suitable for determining their magnitude where such procedures are documented.

 

This Specification is directed specifically to germanium wafers with one or both sides polished. Unpolished wafers or wafers with epitaxial films are not covered; however, purchasers of such wafers may find these specifications helpful in defining their requirements.

 

Referenced SEMI Standards (purchase separately)

SEMI M1 — Specification for Polished Single Crystal Silicon Wafers

SEMI MF26 — Test Method for Determining the Orientation of a Semiconductive Single Crystal

SEMI MF43 — Test Method for Resistivity of Semiconductor Materials

SEMI MF523 — Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces

SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers

SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 0914)

SEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials

SEMI MF673 — Test Method for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge

SEMI MF847 — Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon and Wafers by X-Ray Techniques

SEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates

SEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning

SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning

SEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers

SEMI T5 — Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers

 

Revision History

SEMI M79-0623 (technical revision)

SEMI M79-0218 (technical revision)

SEMI M79-0211 (first published)

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