- SEMI MF154 - Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces
This Standard was technically approved by the Silicon Wafer Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 1, 2016. Available at www.semiviews.org and www.semi.org in March 2016; originally published by ASTM International as ASTM F154-72T; previously published June 2011.
NOTICE: This Document was reapproved with minor editorial changes.
The purpose of this Guide is to list, illustrate, and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers.
Ambiguities and uncertainties regarding surface defects may be resolved by reference to this Guide.
There is close alignment between this Guide and common specifications used for the purchase of silicon wafers.
This Guide contains a compilation of the most commonly observed singularly discernible structures on specular silicon surfaces.
Recommended practices for delineation and observation of these artifacts are referenced. The artifacts described in this Guide are intended to parallel and support the content of the specification form for order entry in SEMI M1, SEMI M57, and other silicon wafer specifications.
These artifacts and common synonyms are arranged alphabetically in Tables 1 and 2 and illustrated in Figures 1 through 79.
Referenced SEMI Standards
SEMI M1 — Specification for Polished Single Crystal Silicon Wafers
SEMI M35 — Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection
SEMI M57 — Specification for Specifying Silicon Annealed Wafers
SEMI M59 — Terminology for Silicon Technology
SEMI MF523 — Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
SEMI MF1725 — Practice for Analysis of Crystallographic Perfection of Silicon Ingots
SEMI MF1726 — Practice for Analysis of Crystallographic Perfection of Silicon Wafers
SEMI MF1727 — Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers
SEMI MF1809 — Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF1810 — Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers
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