- SEMI MF1451 - Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning
This Standard was technically approved by the global Silicon Wafer Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 24, 2011. Available at www.semiviews.org and www.semi.org in May 2012; originally published by ASTM International as ASTM F1451-92; previously published July 2007.
Sori can significantly affect the yield of semiconductor device processing.
Knowledge of this characteristic can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements.
Changes in wafer sori during processing can adversely affect subsequent handling and processing steps. These changes can also provide an important process monitoring function.
This Test Method is suitable for measuring the sori of wafers used in semiconductor device processing in the as-sliced, lapped, etched, polished, epitaxial or other layer condition and for monitoring thermal and mechanical effects on the sori of wafers during device processing.
Referenced SEMI Standards
SEMI M1 — Specifications for Polished Single Crystal Silicon Wafers
SEMI M59 — Terminology for Silicon Technology
SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
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