- SEMI MF1727 - Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers
This Standard was technically approved by the Silicon Wafer Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2015. Available at www.semiviews.org and www.semi.org in November 2015; originally published by ASTM International as ASTM F1727-97; previously published November 2010.
NOTICE: This Document was reapproved with minor editorial changes.
Defects induced by thermal processing of silicon wafers may adversely influence device performance and yield.
These defects are influenced directly by contamination, ambient atmosphere, temperature, time at temperature, and rate of change of temperature to which the specimens are subjected. Conditions vary significantly among device manufacturing technologies. The thermal cycling procedures of this Practice are intended to simulate basic device processing technologies. Oxidation cycles other than specified herein, or multiple oxidation cycles, may sometimes more accurately simulate device-processing procedures. The results obtained may differ significantly from those obtained with the specified oxidation cycles.
The geometry of some patterns revealed by this Practice suggests that they are related to the crystal growth process while others seem related to surface preparation or thermal cycling conditions.
This Practice is suitable for acceptance testing when used with referenced practices and methods.
This Practice covers the detection of crystalline defects in the surface region of silicon wafers. The defects are induced or enhanced by oxidation cycles encountered in normal device processing. An atmospheric pressure oxidation cycle representative of bipolar, metal-oxide-silicon (MOS) and CMOS technologies is included. This Practice reveals strain fields arising from the presence of precipitates, oxidation induced stacking faults, and shallow etch pits. Slip is also revealed that arises when internal or edge stresses are applied to the wafer.
Application of this Practice is limited to specimens that have been chemical or chemical/mechanical polished to remove surface damage from at least one side of the specimen. This Practice may also be applied to detection of defects in epitaxial layers.
The surface of the specimen opposite the surface to be investigated may be damaged deliberately or otherwise treated for gettering purposes or chemically etched to remove damage.
Referenced SEMI Standards
SEMI C28 — Specifications for Hydrofluoric Acid
SEMI C54 — Specifications and Guidelines for Oxygen
SEMI C58 — Specifications for Hydrogen
SEMI M59 — Terminology of Silicon Technology
SEMI MF1809 — Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF1810 — Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers