SEMI MF2166 - Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers -

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Volume(s): Silicon Materials & Process Control
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI MF2166-1110 (Withdrawn 1015) - Withdrawn



This standard was originally published by ASTM International as ASTM F2166-02. It was formally approved by ASTM balloting procedures and adhered to ASTM patent requirements. Though ownership of this standard has been transferred to SEMI, it has not been formally approved by SEMI balloting procedures and does not adhere either to SEMI Regulations dealing with patents or to SEMI Editorial Guidelines. Available at October 2003, to be published November 2003. Last published by ASTM International as ASTM F2166-02.


These practices describe the use of wafers with special electrical and physical characteristics for controlling and monitoring performance of non-contact dielectric characterization systems (NCDCS) that employ corona. Thermally oxidized wafers are not sufficient for this purpose because of parametric drift due to temperature-bias stressing and exposure to the atmosphere. Three methods are described to cover various experimental arrangements: Method A — For systems that employ point source corona, Method B — For systems that employ line source corona and can be programmed to obtain a full set of parameters, and Method C — For systems that employ line source corona but can only determine mobile ion density.


Referenced SEMI Standards

SEMI M20 — Specification for Establishing a Wafer Coordinate System

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