SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets -

Abstract

1  Purpose
1.1  This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together.
2  Scope
2.1  This Guide applies to targets that can be used with two common alignment processes—inner surface alignment and outer surface alignment.
2.2  This Guide covers specification requirements, mark characteristics and applications.

Referenced SEMI Standards (purchase separately)
SEMI M20 — Practice for Establishing a Wafer Coordinate System

Revision History
SEMI MS1-0307 (Reapproved 0525)
SEMI MS1-0307 (Reapproved 0318)
SEMI MS1-0307 (Reapproved 0812)
SEMI MS1-0307 (technical revision)
SEMI MS1-0306 (first published)

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