Overview of Semiconductor Manufacturing Americas 04/21/26

Member Price:  $895.00
Non-Member Price:  $995.00
Overview of Semiconductor Manufacturing  Americas 4/21/26
 
Dates & Times
 
April 21st and April 22, 2026
7:30 AM– 3:00 PM  (Day 1)
7:30 AM – 1:00 PM  ( Day 2)
 
Location
Virtual Training
 
Pricing
Early Bird 
Members:  $895
Non-Members:   $995
 
This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry. 
 
Learning Objectives:
 
  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and ecosystem of the semiconductor industry.

  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip.

  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals. 

 
Course Topics:
 
  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits.

  • Process nodes: Process nodes and their impact on device performance and cost

  • Device physics and transistor operation: Principles of device operation and transistor functionality

  • Crystal growth and wafer prep: Crystal growth techniques and wafer preparation processes

  • Advanced Transistor Technologies: FDSOI, FinFets, and gate all around (GAA) transistors and their impact on device performance.

  • Circuit design and layout: Introduction to circuit design, layout techniques, and tools.

  • Wafer Processing:

    •  Mask-making techniques and materials used in lithography: Techniques & materials used in mask-making & various lithographic methods (DUV, Immersion, EUV)

    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing. and contamination issues. 

    • Etching & Cleaning Processes: Plasma & wet etching processes

    • Ion Implantation and & Diffusion Techniques: Methods for doping & controlling diffusion in semiconductor fabrication. 

    • Deposition Techniques: RTP, CVD, AVD, & ALE techniques & their effect on device performance.

    • Electroplating & Sputtering: Metal deposition techniques used in manufacturing.

    • Packaging & Testing: techniques such as wire bonding, die stacking, flip chip, & chiplets packaging, and semiconductor testing processes.

    • Metrology & Measurement Tools: Tools & methods used for precision measurement in semiconductor manufacturing.

  • Semiconductor Industry Ecosystems: Learning the major players in the industry

 
 
Who should Attend:
This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem. 
 
Cancellation and Rescheduling Policies   
·         Registrants may cancel or reschedule a class no less than 30 days before the class start date. 
·       Cancellations received after the stated deadline will not be eligible for a refund.
·       Cancellations will be accepted via email to semiu-support@semi.org
·        The registrant or the credit card holder must make all refund requests.
·       Refund requests must include the attendee's name, Course Name, and session date.     
·       Refunds will be credited to the original payment method used for payment.
·       SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class's start date.
·       If SEMI cancels a class, the registrants will be offered a full refund.