Overview of Semiconductor Manufacturing Americas 11/11/25

Member Price: $995 $995.00
Non-Member Price: $1095 $1,095.00
Overview of Semiconductor Manufacturing  Americas 11/11/25
 
Dates & Times
 
November 11th and 12th, 2025
9:30 AM– 4:30 PM  (Day 1)
9:30 AM – 1:00 PM  ( Day 2)
 
Location
Virtual Training
 
Pricing
 
Members:  $995  $895
Non-Members:  $1095 $995
 
This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry. 
 
Learning Objectives:
 
  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and ecosystem of the semiconductor industry.
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip.
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals. 
 
Course Topics:
 
  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits.
  • Process nodes: Process nodes and their impact on device performance and cost
  • Device physics and transistor operation: Principles of device operation and transistor functionality
  • Crystal growth and wafer prep: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFets, and gate all around (GAA) transistors and their impact on device performance.
  • Circuit design and layout: Introduction to circuit design, layout techniques, and tools.
  • Wafer Processing:
    •  Mask-making techniques and materials used in lithography: Techniques & materials used in mask-making & various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing. and contamination issues. 
    • Etching & Cleaning Processes: Plasma & wet etching processes
    • Ion Implantation and & Diffusion Techniques: Methods for doping & controlling diffusion in semiconductor fabrication. 
    • Deposition Techniques: RTP, CVD, AVD, & ALE techniques & their effect on device performance.
    • Electroplating & Sputtering: Metal deposition techniques used in manufacturing.
    • Packaging & Testing: techniques such as wire bonding, die stacking, flip chip, & chiplets packaging, and semiconductor testing processes.
    • Metrology & Measurement Tools: Tools & methods used for precision measurement in semiconductor manufacturing.
  • Semiconductor Industry Ecosystems: Learning the major players in the industry
 
 
Who should Attend:
This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem. 
 
Cancellation and Rescheduling Policies   
·         Registrants may cancel or reschedule a class no less than 30 days before the class start date. 
·       Cancellations received after the stated deadline will not be eligible for a refund.
·       Cancellations will be accepted via email to semiu-support@semi.org
·        The registrant or the credit card holder must make all refund requests.
·       Refund requests must include the attendee's name, Course Name, and session date.     
·       Refunds will be credited to the original payment method used for payment.
·       SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class's start date.
·       If SEMI cancels a class, the registrants will be offered a full refund. 

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