Overview of Semiconductor Manufacturing US 4/22/25

 Overview of Semiconductor Manufacturing  

 Dates & Times 

 April 22, 2025 - April 23, 2025   

 1^st Day: 8:30am-5pm 
 2^nd Day:  8:30am-1:30pm 

SEMI 

673 S. Milpitas Blvd.

                  Milpitas, CA 95035

This course provides a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). It's designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process. 

Learning Objectives: 

• Gain a comprehensive understanding of the semiconductor industry and the manufacturing process, design, and eco-system of the semiconductor industry and understand the jargon, tools, and materials used in the design and fabrication of an IC 
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals 

Course Topics: 

• Basic electronics and microelectronics: Terms and definitions and introduction to microelectronics and integrated circuits
• Process Nodes: Process nodes and their impact on device performance and cost
• Device physics and Transistor Operation: Principles of device operation and transistor functionality
• Crystal Growth and Wafer Prep: An overview of crystal growth techniques used in semiconductor manufacturing 
• Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance 
• Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
• Semiconductor Industry Ecosystem: The major players in the industry
• Wafer Processing:

• Mask-Making & Lithography: Techniques and materials used in mask making & various lithographic methods (DUV, Immersion, EUV)
• Clean room Environments: Importance of clean rooms in semiconductor mfg. and contamination issues
• Etching and Cleaning Processes: Plasma & Wet Etching Processes
• Ion Implantation & Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
• Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance 
• Electroplating & Sputtering: Metal deposition techniques used in manufacturing
• Packaging & Testing: Techniques such as wire bonding, die stacking, flip chip, & chiplets packaging, semiconductor testing processes
• Metrology & Measurement Tools: Tools and used for precision measurement in semiconductor manufacturing 

Who Should Attend: 

Anyone wanting an understanding of semiconductor manufacturing. 

Cancelling and Rescheduling by Registrants

Registrants may cancel or reschedule a class at least 30 days before the class start date. Cancellations received after the stated deadline will not be eligible for a refund. Cancellations will be accepted via email to semiu-support@semi.org 

All refund requests must be made by the registrant or the credit card holder. Refund requests must include the name of the attendee, Course name, and date of session. Refunds will be credited to the original payment method.

SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 10 business days before the class start date. If SEMI cancels a class, the registrants will be offered a full refund.  At no time are travel reservations made by the registrant, refundable by SEMI, whether the class cancellation is initiated by SEMI or the registrant. This includes flight fees, hotel reservations, car and or ground transportation costs or cancellation fees.