Overview of Semiconductor Mfg. US 11/13/2024

Overview of Semiconductor Manufacturing Webinar  

Dates & Times

November 13 & 14^th  

7:30 AM– 3:30 PST 

7:30 AM – 11:30 PST

Location

Webinar 

Pricing

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry. 

Learning Objectives:

• Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and ecosystem of the semiconductor industry.
• Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip.
• Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals. 

Course Topics:

• Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits.
• Process nodes: Process nodes and their impact on device performance and cost
• Device physics and transistor operation: Principles of device operation and transistor functionality
• Crystal growth and wafer prep: Crystal growth techniques and wafer preparation processes
• Advanced Transistor Technologies: FDSOI, FinFets, and gate all around (GAA) transistors and their impact on device performance.
• Circuit design and layout: Introduction to circuit design, layout techniques, and tools.
• Wafer Processing:
  •  Mask-making techniques and materials used in lithography: Techniques & materials used in mask-making & various lithographic methods (DUV, Immersion, EUV)
  • Clean Room Environments: Importance of clean rooms in semiconductor mfg. and contamination issues. 
  • Etching & Cleaning Processes: Plasma & wet etching processes
  • Ion implantation and & Diffusion Techniques: Methods for doping & controlling diffusion in semiconductor fabrication. 
  • Deposition Techniques: RTP, CVD, AVD, & ALE techniques & their effect on device performance.
  • Electroplating & Sputtering: Metal deposition techniques used in mfg.
  • Packaging & Testing: techniques such as wire bonding, die stacking, flip chip, & chiplets packaging, and semiconductor testing processes.
  • Metrology & Measurement Tools: Tools & methods used for precision measurement in semiconductor mfg.
• Semiconductor Industry Ecosystems: Learning the major players in the industry

Who should Attend:

This course is suitable for anyone seeking a better understanding of the semiconductor manufacturing.

Cancellation and Rescheduling Policies   

• Registrants may cancel or reschedule a class no less than 30 days before the class start date.
• Cancellations received after the stated deadline will not be eligible for a refund.
• Cancellations will be accepted via email to semiu-support@semi.org
• All refund requests will be credited to the original payment method used for payment.
• SEMI reserves the right to cancel any course due to low enrollment or other circumstances which would make the event unavailable 7 business days before the class’s start date.
• If SEMI cancels a class, the registrants will be offered a full refund. 

At no time are travel reservations made by the registrant, refundable by SEMI, whether the class cancellation is initiated by SEMI or the registrant.  This includes flight fees, hotel reservations, car and or ground transportation costs, or cancellation fees.