Packaging Quality and Reliability in the Era of Chiplets US/EU 3/11

Member Price:  $149.00
Non-Member Price:  $199.00
Packaging Quality and Reliability in the Era of Chiplets
 
Dates & Times
March 11th, 2027 
Americas/EU 
8:00 am - 12:00 pm PDT
 
 
Location
Virtual Training
 
Pricing
 
Members:  $149
Non-Members:   $249
 
This course introduces various aspects of demonstrating Quality and Reliability in semiconductor packaging.
 
Given the immense cost of AI products and platforms, an important and differentiating factor for a successful packaging technology supplier is offering stellar quality and reliability (Q&R) to preserve the value of the expensive silicon chiplets. One way to guarantee stellar quality and reliability of products with new technologies is to overdesign them, but that can be very expensive. Alternatively, under-designing packages from a reliability perspective may be cheaper; however, it will likely trigger premature failures in the field, leading to higher ownership costs and frustration for customers. Optimizing this balance to deliver new technology and meet customer expectations requires drawing from experience (history), judicious use of simulations, augmenting with empirical data, and more importantly, engineering rigor to make the right technology decisions. 
 
Given the complicated, and expensive, nature of these semiconductor packages, quality and reliability are a central theme for such complex products. We will discuss quality metrology for maintaining outgoing product quality and accelerated testing methods to predict field performance using the physics-of-failure methodology. 
 
The course will prepare the audience to tackle technical problems (related to failure mechanisms and product qualification) by providing a blueprint that aids in proving that the technology capabilities can meet the market demands. The participants will experience the concepts through hands-on exercises throughout the course. 
 
The course concludes by presenting information on current and emerging technologies and the attendant challenges, which include hybrid bonding, co-packaged optics, and advanced substrate materials. The course also touches upon challenges with thermal dissipation for high-power AI products, and the bottlenecks now shaping next-generation semiconductor package roadmaps. 
 

Learning Objectives:

  • A brief overview of semiconductor packaging 
  • Understand the fundamentals of quality and reliability principles. 
  • Understand the concept of the bathtub curve and its use for Q&R optimization.  
  • Introduce the philosophy, and practical elements, of product qualification.
  • Understand use conditions based on different markets like Automotive, Data Centers, Mobile, Space, etc.
  • Understand different quality tests and reliability stress tests done for product qualification. 
  • Get insight into typical failure mechanisms and failure analysis techniques. 
  • Understand different quality tests and reliability stress tests done for product qualification. 
  • Introduction to acceleration models for predicting useful life of the package. 
  • Hands-on exercises related to these concepts.

Who Should Attend:

This course is suitable for anyone seeking a better understanding of how quality and reliability evaluation is performed for semiconductor packaging. 
 
Cancellation and Rescheduling Policies   
·        Registrants may cancel or reschedule a class no less than 30 days before the class start date. 
·        Cancellations received after the stated deadline will not be eligible for a refund.
·        Cancellations will be accepted via email to semiu-support@semi.org
·        The registrant or the credit card holder must make all refund requests.
·        Refund requests must include the attendee's name, Course Name, and session date.     
 
 
 

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