PCB, Board Assembly and Its Soldering

Course Description 

The semiconductor industry provides critical enabling technology for many products and fields and has been in periods of rapid growth.  While electronics goods dominate the market, communications, medical devices and the automotive industry show signs of increased potential. The course provides foundational knowledge of PCBs, the board assembly process and soldering. 

This course is the second course of the IC Packaging curriculum for beginners. By learning about the concepts taught, engineers can take on more issues they encounter in their design and manufacturing operation. After all, IC packaging requires interdisciplinary knowledge, such as mechanical, materials, chemical and electronics engineering.

Course Objectives 

• Describe how through hole technology and wave soldering functions.
• Explain what surface mount technology and reflow soldering are. 
• Summarize PCB and its materials.
• Identify the constituents of solder paste.
• Describe what eutectic solder is.
• Interpret the selection of lead-free solders and its mechanism.

Course Duration

40 minutes

Target Audience 

Sales engineers/business development executives, and college students who are interested in joining the semiconductor industry, especially OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can also take up this course to be more workforce ready. 

Requisite Knowledge 

First or second year college level science background students.