SEMI PV72 - Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation -

Abstract

This Standard was technically approved by the Photovoltaic Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 4, 2016. Available at www.semiviews.org and www.semi.org in March 2016.

The purpose of this Standard is to standardize the accelerated evaluation method for moisture resistance of photovoltaic (PV) encapsulation. The test is performed with designed mini modules in a pressure cooker with moisture condensing or moisture saturated steam environments.

Compared with damp heat (DH) tests, a pressure cooker test (PCT) is a highly accelerated test which employs high pressure, humidity and temperature under condensing conditions to accelerate moisture penetration into laminated mini modules.

PV encapsulant suppliers, PV module manufacturers and buyers, or any other interested party, can thus have common standards to quickly test and select PV encapsulation materials for PV modules.

This Test Method applies primarily to evaluate moisture and temperature resistance of the encapsulation.

This Test Method is used to evaluate the performance of PV encapsulation. The PV encapsulation includes lamination properties and encapsulated materials used in in PV modules such as ethylene vinyl acetate (EVA), backsheet or any other materials that protect crystalline Si cells in PV modules.

Some cautions should be considered when performing this test and evaluating test results. Failure mechanisms, both internal (e.g., due to embrittlement of polyethylene terephthalate (PET) and external (e.g., moisture ingress from a non-sealed edge), may be produced which are not applicable to the intended application use conditions.

This Standard defines the specific structure of PV encapsulant samples for different failure mode evaluation.

This Standard defines the specific testing methods, testing conditions and evaluation method for PV encapsulation.

Referenced SEMI Standards

None.

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