SEMI PV81 - Guide for Specifying Low Pressure Horizontal Diffusion Furnace -

Abstract

This Standard was technically approved by the Photovoltaic Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 13, 2017. Available at www.semiviews.org and www.semi.org in March 2018.

　

Compared with atmospheric horizontal diffusion furnace, low pressure horizontal diffusion technology has advantages of higher volume production, lower space requirement, less energy consumption and better sheet resistance uniformity, but all of these advantages are based on several key parameters of equipment. This Guide is provided as a reference for diffusion furnace equipment manufacturers and customers, so that low pressure horizontal diffusion can achieve less cost and higher performance.

 

Low pressure horizontal diffusion furnace described in this Guide is mainly used for building p-n junction under low pressure condition in the silicon solar cells diffusion production line.

　

This Guide analyzes several key parameters which influence the diffusion process results in low pressure. These parameters which are verified by series of experiments and tests on the production lines are valuable references for horizontal diffusion furnace equipment manufacturers.

　

Referenced SEMI Standards

SEMI E6 — Guide for Semiconductor Equipment Installation Documentation
SEMI E56 — Test Method for Determining Accuracy, Linearity, Repeatability, Short-Term Reproducibility, Hysteresis, and Deadband of Thermal Mass Flow Controllers
SEMI E69 — Test Method for Determining Reproducibility and Zero Drift for Thermal Mass Flow Controllers
SEMI F74 — Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems
SEMI M59 — Terminology for Silicon Technology
SEMI MS10 — Test Method to Measure Fluid Permeation Through MEMS Packaging Materials
SEMI S6 — EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
SEMI T8 — Specification for Marking of Glass Flat Panel Display Substrates with a Two-Dimensional Matrix Code Symbol
SEMI T9 — Specification for Marking of Metal Lead-Frame Strips with a Two-Dimensional Data Matrix Code Symbol
SEMI T14 — Specification for Micro ID on 300 mm Silicon Wafers

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