SEMI S10 - Safety Guideline for Risk Assessment and Risk Evaluation Processes -

Abstract

NOTICE: This Safety Guideline was completely rewritten in 2025.

1  Purpose
1.1  The primary purpose of this Safety Guideline is to define a consistent means, that can be invoked by other SEMI Safety Guidelines, of estimating risk of harm by semiconductor manufacturing equipment (SME) to personnel, the environment, and to the equipment itself.
NOTE 1: That purpose is addressed in § 6, § 7, APPENDIX 1, and APPENDIX 2.
1.2  The secondary purpose of this Safety Guideline is estimation of risk of harm by an object other than SME (e.g., chemical processes and bulk chemical distribution systems) to personnel, the environment, and to the object itself.
NOTE 2: Hereafter, object(s) under consideration (OUC) refers to SME (as mentioned in ¶ 1.1) or to other objects (as mentioned in ¶ 1.2).
NOTE 3: RELATED INFORMATION 6 provides guidance on the estimation of risk of harm by the OUC to facilities and to objects other than the OUC.
NOTE 4: Historically, risks of harm to facilities and to objects other than the OUC have been included in SEMI S10. However, the risk of harm to a facility and to objects other than the OUC cannot be assessed without substantial information about the facility and the other objects, and that information is usually not available when risk assessments are done during SME development, including during SME assessments to SEMI Safety Guidelines, such as SEMI S2. Risk assessments during SME development are a principal use of SEMI S10. Therefore, assessing risks to a facility and other objects has been segregated from the normative portions of SEMI S10 into RELATED INFORMATION 6.
1.3  The tertiary purpose of this Safety Guideline is to describe, generally, several other aspects of risk assessment (e.g., assembling information and personnel, hazard identification) and risk control (e.g., risk evaluation and risk reduction).
1.4  This Safety Guideline provides a procedure for carrying out risk assessments on OUCs in the semiconductor and similar industries.
1.5  This Safety Guideline is also intended to assist in the development of strategies to prioritize and control risks.
2  Scope
2.1  This Safety Guideline applies to the assessment of risks of harm to personnel, the environment, and the OUC, posed by the OUC throughout its lifecycle (including risks posed by the processes performed by the OUC).
NOTE 5: The severity and likelihood tables were developed primarily for use in estimating risks posed by SME.
NOTE 6: Risk assessments are usually performed based on documentation and on inspection or testing of representative (e.g., with similar hazards and risk controls) OUCs, but the result is usually considered to apply to the entire population of such objects.
2.2  This Safety Guideline provides recommendations for assembling information and personnel for risk estimation.
2.3  This Safety Guideline describes the hazard identification process.
2.4  This Safety Guideline defines a process and specific criteria for risk estimation.
2.5  This Safety Guideline provides general guidance on risk evaluation and risk reduction processes.
NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.

Referenced SEMI Standards (purchase separately)
SEMI F1 — Specification for Leak Integrity of High-Purity Gas Piping Systems and Components
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI S8 — Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
SEMI S14 — Safety Guideline for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
 

Revision History

SEMI S10-0526 (complete rewrite)

SEMI S10-0423E (editorial revision)

SEMI S10-0423 (technical revision)

SEMI S10-1119 (technical revision)

SEMI S10-0815E (editorial revision)

SEMI S10-0815 (technical revision)

SEMI S10-0215 (technical revision)

SEMI S10-0115 (technical revision)

SEMI S10-0307E (editorial revision)

SEMI S10-0307 (technical revision)

SEMI S10-1103 (complete rewrite)

SEMI S10-1296 (first published)

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