SEMI Texas Spring Forum 2024 Registration

Advancements in Advanced Packaging: Unveiling the Future of Electronics Integration
Delve into the cutting-edge technologies revolutionizing the world of electronics integration. As electronic devices continue to evolve, the demand for smaller, faster, and more efficient packages becomes imperative. This breakfast forum organized by the SEMI Texas Chapter will explore the latest trends, breakthroughs, and innovations in advanced packaging that are reshaping the landscape of electronics manufacturing in Texas and other key areas of the US.
Some key topics to be covered are 3D IC Integration, Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP) Design, Heterogeneous Integration, Advanced Materials for Packaging and Emerging Technologies.

CANCELLATION POLICY:
Registration is final. No refunds provided. No substitutions.

EVENT CONTACT:
Michelle Fabiano 
Email:  mfabiano@semi.org