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Semiconductor Packaging Design and Manfacturing
Description
Semiconductor Packaging Design and Manufacturing introduces the principles and practices used to design, assemble, and evaluate semiconductor packages. Learners will explore how packages connect, protect, and support integrated circuits in modern devices, from initial concepts through advanced manufacturing and integration strategies.
The series covers the anatomy of packages, core manufacturing steps, and the engineering challenges involved in scaling, thermal management, and interconnect design. Examples and insights from industry subject matter experts illustrate how packaging decisions impact reliability, performance, and product integration across multiple sectors.
Developed in collaboration with industry professionals and subject matter experts, this content content is designed for engineers seeking a structured understanding of semiconductor packaging processes and technologies.
Upon successful completion, learners will earn a certificate of completion from Arizona State University.
Curriculum Duration
24 hours
What you’ll learn
By the end of this series, learners will be able to:
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Explain the function and design considerations of semiconductor packages and substrates
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Identify key process steps in package manufacturing, including die attach, underfill, solder balling, and final test
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Analyze how packaging enables performance and reliability in advanced electronic systems
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Describe packaging trade-offs and trends, including heterogeneous integration and interconnect scaling
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Recognize how process control systems support quality and consistency in package production
Skills you’ll gain
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Semiconductor package design
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Package manufacturing process flow (sort, assembly, test)
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Substrate structure and material selection
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Mechanical, thermal, and electrical performance factors
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Process control using statistical methods
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Emerging trends in heterogeneous integration and advanced interconnects
Target audience
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Engineers working in semiconductor packaging, manufacturing, or product development
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Technicians and process engineers looking to expand into packaging-related roles
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New graduates or professionals transitioning into semiconductor supply chain functions
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Professionals seeking a foundational understanding of how packaging influences electronics reliability and system integration
No prior packaging experience is required, though basic familiarity with semiconductor components is recommended.
Courses and Descriptions
Introduction to Semiconductor Packaging - Covers the role of packaging in modern electronics, including package anatomy, function, types, and the challenges of scaling, integration, and reliability.
Semiconductor Packaging Manufacturing - Explores the step-by-step manufacturing process for packages, including sort, die attach, underfill, ball attach, and testing, with a focus on process control and quality assurance.
Advanced Semiconductor Packaging - Examines cutting-edge packaging technologies used at sub-10nm nodes, with emphasis on heterogeneous integration, die-to-die interconnects, and co-packaging for high-performance systems.
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