SEMI T9 - Specification for Marking of Metal Lead-Frame Strips with a Two-Dimensional Data Matrix Code Symbol
This Standard was technically approved by the Traceability Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 4, 2015. Available at www.semiviews.org and www.semi.org in February 2016; originally published in 1998; previously published November 2010.
This Specification provides a marking symbology that can be used to mark metal lead-frame strips.
This Specification defines the geometric and spatial relationships and content (including the error checking and correcting code) of rectangular two-dimensional (2-D), machine-readable, binary Data Matrix symbology for front-surface marking of metal lead-frame strips (also called ‘strips’). It may be used in conjunction with the alphanumeric marking codes specified in SEMI M12 and SEMI M13.
This Specification defines a 22-character default message that is included in all marks, and option for up to 50 additional characters, for a total of 72 message characters. An optional shorter message contains 12 to 16 message characters; the resulting square field is narrower but taller than the 22-character rectangular one.
This Specification provides a suggested location for the code symbol. It also provides guidelines for specifying other code locations when the suggested location is not suitable for an application.
Although this Specification does not specify the marking techniques that may be employed when complying with its requirements, it is assumed that the symbol will be obtained by laser scribing individual dots.
Data Matrix symbology is applicable to a broad range of lead-frame materials including copper and Alloy 42 in both bare and plated conditions. The format and algorithms of this code are based on two-dimensional symbology specified in ISO/IEC 16022.
This Specification supports EIA Package Marking Specification by enabling individual die tracking in the manufacturing steps between die attach and device packaging marking.
Referenced SEMI Standards
SEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Wafers
SEMI M13 — Specification for Alphanumeric Marking of Silicon Wafers