SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers -

Abstract

This specification was technically approved by the global Traceability Committee and is the direct responsibility of the Japanese Traceability Committee. Current edition approved by the Japanese Regional Standards Committee on July 23, 2004. Initially available at www.semi.org September 2004; to be published November 2004.

 

NOTICE: The designation number of T14 was updated during the 0705 cycle to reflect the creation of T14.1.

 

The purpose of this document is to specify a new means of identification with the Micro ID on 300mm polished monocrystalline Silicon wafer with polished edge for process control. The objective of the Micro ID is to keep unique information to be assigned in the device manufacturing process on the location defined on the wafer bevel.

 

Subordinate Standard:

SEMI T14.1-0705 - Specification for the Micro ID of Short Vertical Dimension on 300 mm Wafers

　

Referenced SEMI Standards

SEMI M1 — Specifications of Polished Monocrystalline Silicon Wafers
SEMI M1.15 — Standard for 300 mm Polished Monocrystalline Silicon Wafers (Notched)
SEMI T1 — Specifications for Back Surface Bar Cord Marking of Silicon Wafers
SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

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