SEMI T17 - Specification of Substrate Traceability -

Abstract

The purpose of this Specification is to provide standard data representation and its communication of Die Trace Data for SEMI T13 Device Tracking Standard especially for substrate traceability. The final goal of this Standard is to realize the traceability of semiconductor, flat panel display (FPD), or MEMS devices as described in SEMI T13. This Standard clarifies a part of the traceability specific for substrate such as wafer or some other substrates defined in SEMI T13. This Standard applies SEMI T13 for substrates on equipment or Die Trace Machine, and specifies related things for the substrates.

This Standard specifies data representation, communication, and related things to make capability for tracing substrates on the machine compliant to SEMI T13. This Standard does not specify anything which major purposes are outside of traceability (e.g., manufacturing execution, marketing, or safety).

Referenced SEMI Standards (purchase separately)

SEMI E5 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)

SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)

SEMI E39 — Specification for Object Services: Concept, Behavior and Services (OSS)

SEMI E98 — Provisional Specification of Object Based Equipment Model (OBEM)

SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

SEMI T12 — Specification for Tracing Jigs and Implements

SEMI T13 — Specification for Device Tracking: Concepts, Behavior and Services

SEMI T14 — Specification for Micro ID on 300 mm Silicon Wafers

Revision History

SEMI T17-0706 (Reapproved 0923)

SEMI T17-0706 (Reapproved 0718)

SEMI T17-0706 (Reapproved 0812)

SEMI T17-0706 (first published)

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