SEMI T17 - Specification of Substrate Traceability

Volume(s): Traceability
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Traceability Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 1, 2018. Available at www.semiviews.org and www.semi.org in July 2018; originally published July 2006; previously published August 2012.

 

The purpose of this Document is to provide standard data representation and its communication of Die Trace Data for SEMI T13 Device Tracking Standard especially for substrate traceability. The final goal of this Standard is to realize the traceability of semiconductor, flat panel display (FPD), or MEMS devices as described in SEMI T13. This Standard clarifies a part of the traceability specific for substrate such as wafer or some other substrates defined in SEMI T13. This Document applies SEMI T13 for substrates on equipment or Die Trace Machine, and specifies related things for the substrates.

 

This Document specifies data representation, communication and related things to make capability for tracing substrates on the machine compliant to SEMI T13. This Document does not specify anything which major purposes are outside of traceability (e.g., manufacturing execution, marketing or safety).

 

Referenced SEMI Standards

SEMI E5 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E39 — Object Service Standard: Concept, Behavior and Services (OSS)
SEMI E98 — Provisional Specification of Object Based Equipment Model (OBEM)
SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
SEMI T12 — Specification for Tracing Jigs and Implements
SEMI T13 — Specification for Device Tracking: Concepts, Behavior and Services
SEMI T14 — Specification for Micro ID on 300 mm Silicon Wafers


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