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3D00800 - SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D00600 - SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration
SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration Sale priceMember Price: $144.00
Non-Member Price: $187.00
3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack
SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack Sale priceMember Price: $144.00
Non-Member Price: $187.00
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