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E18800 - SEMI E188 - Specification for Malware Free Equipment Integration
SEMI E188 - Specification for Malware Free Equipment Integration Sale priceMember Price: $286.00
Non-Member Price: $380.00
F00300 - SEMI F3 - Guide for Welding Stainless Steel Tubing for Semiconductor Manufacturing Applications
SEMI F3 - Guide for Welding Stainless Steel Tubing for Semiconductor Manufacturing Applications Sale priceMember Price: $148.00
Non-Member Price: $193.00
F00200 - SEMI F2 - Specification for 316L Stainless Steel Tubing for General Purpose Semiconductor Manufacturing Applications
SEMI F2 - Specification for 316L Stainless Steel Tubing for General Purpose Semiconductor Manufacturing Applications Sale priceMember Price: $148.00
Non-Member Price: $193.00
E13700 - SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南
SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南 Sale priceMember Price: $148.00
Non-Member Price: $193.00
E18000 - SEMI E180 - 通过ICP-MS测量半导体晶圆加工过程中关键腔室部件表面金属污染的试验方法
SEMI E180 - 通过ICP-MS测量半导体晶圆加工过程中关键腔室部件表面金属污染的试验方法 Sale priceMember Price: $148.00
Non-Member Price: $193.00
F02000 - SEMI F20 - 用于通用、高纯和超高纯半导体制造组件的316L不锈钢棒材、锻材、挤压型材、板材和管材的规范
SEMI F20 - 用于通用、高纯和超高纯半导体制造组件的316L不锈钢棒材、锻材、挤压型材、板材和管材的规范 Sale priceMember Price: $286.00
Non-Member Price: $380.00
E18700 - SEMI E187 - Specification for Cybersecurity of Fab Equipment
SEMI E187 - Specification for Cybersecurity of Fab Equipment Sale priceMember Price: $286.00
Non-Member Price: $380.00
E04400 - SEMI E44 - Guide for Procurment and Acceptance of Minienvironments
SEMI E44 - Guide for Procurment and Acceptance of Minienvironments Sale priceMember Price: $148.00
Non-Member Price: $193.00
E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP
SEMI E185 - Specification for 300 mm Tape Frame FOUP Sale priceMember Price: $148.00
Non-Member Price: $193.00
E18400 - SEMI E184 - Specification for 300 mm Tape Frame FOUP Load Port
SEMI E184 - Specification for 300 mm Tape Frame FOUP Load Port Sale priceMember Price: $148.00
Non-Member Price: $193.00
Flex Electronics Webinar Master Class Series: Batteries, AI, HI, Materials, Applications, Sustainability (On Demand 2021)
Flex Electronics Webinar Master Class Series: Batteries, AI, HI, Materials, Applications, Sustainability (On Demand 2021) Sale priceMember Price: $149.00
Non-Member Price: $229.00
F11900 - SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution
SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution Sale priceMember Price: $148.00
Non-Member Price: $193.00
F11800 - SEMI F118 - Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components
SEMI F118 - Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components Sale priceMember Price: $148.00
Non-Member Price: $193.00
F11700 - SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems
SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems Sale priceMember Price: $148.00
Non-Member Price: $193.00
Flex Electronics Webinar Master Class: December 2021 (On Demand)
Flex Electronics Webinar Master Class: December 2021 (On Demand) Sale priceMember Price: $49.00
Non-Member Price: $99.00
E18600 - SEMI E186 - Specification for Location and Dimensions for Power Connectors and Ethercat Ports in Mass Flow Controllers and Mass Flow Meters
SEMI E186 - Specification for Location and Dimensions for Power Connectors and Ethercat Ports in Mass Flow Controllers and Mass Flow Meters Sale priceMember Price: $148.00
Non-Member Price: $193.00
E18300 - SEMI E183 - Specification for Rich Interactive Test Database (RITdb)
SEMI E183 - Specification for Rich Interactive Test Database (RITdb) Sale priceMember Price: $148.00
Non-Member Price: $193.00
C10300 - SEMI C103 - Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks Used in Semiconductor Manufacturing
SEMI C103 - Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks Used in Semiconductor Manufacturing Sale priceMember Price: $148.00
Non-Member Price: $193.00
Flex Electronics Webinar Master Class: October 2021 (on demand)
Flex Electronics Webinar Master Class: October 2021 (on demand) Sale priceMember Price: $49.00
Non-Member Price: $99.00
PV05000 - SEMI PV50 - Specification for Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock
SEMI PV50 - Specification for Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock Sale priceMember Price: $148.00
Non-Member Price: $193.00
Flex Electronics Webinar Master Class: September 2021 (On Demand)
Flex Electronics Webinar Master Class: September 2021 (On Demand) Sale priceMember Price: $49.00
Non-Member Price: $99.00
F11600 - SEMI F116 - Guide for Drain Segregation for Semiconductor Manufacturing Tools to Support Site Water Reuse
SEMI F116 - Guide for Drain Segregation for Semiconductor Manufacturing Tools to Support Site Water Reuse Sale priceMember Price: $148.00
Non-Member Price: $193.00
D08200 - SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays
SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays Sale priceMember Price: $148.00
Non-Member Price: $193.00
M09000 - SEMI M90 - Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy After Preferential Etching
SEMI M90 - Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy After Preferential Etching Sale priceMember Price: $148.00
Non-Member Price: $193.00