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From Concept to Reality: Advancing Digital Twins in Semiconductor Manufacturing Materials
Sale priceMember Price: $300.00
Non-Member Price: $300.00
Non-Member Price: $300.00
Front of Line Assembly
Sale priceMember Price: $89.00
Non-Member Price: $119.00
Non-Member Price: $119.00
Future of Computing: Sustainable AI Systems
Sale priceMember Price: $175.00
Non-Member Price: $225.00
Non-Member Price: $225.00
SEMI G1 - Specification for Cerdip Package Constructions
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G1 - 仕様Cer-DIPパッケージ構造
Sale priceMember Price: $171.00
Non-Member Price: $224.00
Non-Member Price: $224.00
SEMI G2 - CERDIPパッケージ用金属リードフレームの仕様
Sale priceMember Price: $171.00
Non-Member Price: $224.00
Non-Member Price: $224.00
SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G3 - Specification for Sidebrazed Laminates
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G3 - 仕様 側面ろう付け積層板
Sale priceMember Price: $171.00
Non-Member Price: $224.00
Non-Member Price: $224.00
SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様
Sale priceMember Price: $171.00
Non-Member Price: $224.00
Non-Member Price: $224.00
SEMI G5 - Standard for Ceramic Chip Carriers
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G5 - 仕様 セラミックチップキャリア（CCC）
Sale priceMember Price: $171.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G6 - Test Method for Seal Ring Flatness
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G6 - 検査方法 封止リング平坦度
Sale priceMember Price: $171.00
Non-Member Price: $180.00
Non-Member Price: $180.00
SEMI G8 - Test Method for Gold Plating
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G8 - 金めっきの試験方法
Sale priceMember Price: $171.00
Non-Member Price: $180.00
Non-Member Price: $180.00
SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
Regular price$300.00 USD
Sale price$187.00 USD
SEMI G9 - 仕様 スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム
Sale priceMember Price: $171.00
Non-Member Price: $180.00
Non-Member Price: $180.00
SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
Sale priceMember Price: $171.00
Non-Member Price: $224.00
Non-Member Price: $224.00
SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法
Sale priceMember Price: $171.00
Non-Member Price: $224.00
Non-Member Price: $224.00
SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00