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SEMI C55 - Specification for Liquid Carbon Dioxide (CO2) Used in Near Critical, Critical and Supercritical Applications, >/ 99.99% Quality
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C3.6 - Specification for Phosphine (PH3) in Cylinders, 99.98% Quality
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C3.58 - Specification for Octafluorocyclobutane, C4F8, Electronic Grade in Cylinders, 99.999% Quality
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C3.39 - Specification for Nitrogen Trifluoride (NF3), 99.98%
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C3.37 - Specification for Hexafluoroethane (C2F6), 99.97% Quality
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C3.32 - Specification for Chlorine (Cl2), 99.996% Quality
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C3.27 - Specification for Boron Trifluoride (BF3) in Cylinders, 99.0% Quality
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C3.2 - Specification for Arsine (AsH3) in Cylinders, 99.94% Quality
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI C23 - Specification for Buffered Oxide Etchants
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI 3D15 - Guide for Overlay Performance Assessment for 3DS-IC Process
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00
SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack
Sale priceMember Price: $144.00
Non-Member Price: $187.00
Non-Member Price: $187.00