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D08700 - SEMI D87 - Test Method for Response Time Evaluation of Displays with Variable Refresh Rate
E19101 - SEMI E191.1 - Specification for SECS-II Protocol for Computing Device Cybersecurity Status Reporting
D08500 - SEMI D85 - Guide for the Tone Reproduction Curves for Transparent Displays
SEMI D85 - Guide for the Tone Reproduction Curves for Transparent Displays Sale priceMember Price: $148.00
Non-Member Price: $193.00
FH00300 - SEMI FH3 - Guide for Salt Mist and Washability Test Flow for Control Module Connector of Wearables
D08400 - SEMI D84 - Terminology for FPD Phase Shift Mask and Mask Blanks
SEMI D84 - Terminology for FPD Phase Shift Mask and Mask Blanks Sale priceMember Price: $148.00
Non-Member Price: $193.00
PV09800 - SEMI PV100 - Test Method of Wind Uplift Resistance for Photovoltaic Modules Roof (BIPV)
HB01400 - SEMI HB14 - Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate
D08300 - SEMI D83 - Test Method for Warm-Up Properties of Display Picture Quality
SEMI D83 - Test Method for Warm-Up Properties of Display Picture Quality Sale priceMember Price: $148.00
Non-Member Price: $193.00
G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G10100 - SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G09900 - SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging
E13700 - SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南
SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南 Sale priceMember Price: $148.00
Non-Member Price: $193.00
F02000 - SEMI F20 - 用于通用、高纯和超高纯半导体制造组件的316L不锈钢棒材、锻材、挤压型材、板材和管材的规范
E04400 - SEMI E44 - Guide for Procurment and Acceptance of Minienvironments
SEMI E44 - Guide for Procurment and Acceptance of Minienvironments Sale priceMember Price: $148.00
Non-Member Price: $193.00
F11900 - SEMI F119 - Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution
PV05000 - SEMI PV50 - Specification for Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock
D08200 - SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays
SEMI D82 - Test Method for Viewing Angle of Flat Panel Displays Sale priceMember Price: $148.00
Non-Member Price: $193.00
M09000 - SEMI M90 - Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy After Preferential Etching
D08100 - SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays
SEMI D81 - Test Method for Dimming Properties of Flat Panel Displays Sale priceMember Price: $148.00
Non-Member Price: $193.00
M08900 - SEMI M89 - Test Method for Recombination Lifetime of the Epilayer of the Silicon Epitaxial Wafer (p/p+, n/n+) by the Short Wavelength Excitation Microwave Photoconductive Decay Method
A00500 - SEMI A5 - Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX)